Tender for Supply Of 5mil Rt Duroid 6002 Copper Clad Laminate --, Laminate, Dielectric Constant At 10ghz, Dissipation Factor/loss Tangent At 10ghz, Operating Temperature, Thermal Co-efficient Of Dielectric Constant, Moisture Absorption, Dielectric Thickness, Copper Thickness, Copper Cladding Type, Copper Peel Strength, Coefficient Of Thermal Expansion (cte) In X, Coefficient Of Thermal Expansion (cte) In Y, Coefficient Of Thermal Expansion (cte) In Z, Thermal Conductivity, Density, Volume Resistivity, Surface Resistivity, Laminate Size (l X (w), Dielectric Constant And Loss Tangent Variation With Temperature, R&qa Requirement in Ahmedabad - Gujarat

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