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Tender for Supply Of 656-gw0222 (silicon Carbide Grinding Wheel (resin Bond) Size: 125 (dia) X 13(thickness) X 20 Mm) in Koraput - Odisha

Tender Details

Reference # :

42007774

Description :

Tenders for Supply Of 656-gw0222 (silicon Carbide Grinding Wheel (resin Bond) Size: 125 (dia) X 13(thickness) X 20 Mm)

Ownership :

Sector :

Tender Values

Value :

NA

EMD :

NA

Doc. Cost :

NA

Important Dates

Due date :

15 Oct, 2025

Open date :

15 Oct, 2025

Publish date :

24 Sep, 2025

Location

Location :

Koraput - Odisha ( IN )

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