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Tender for Supply Of Integrated Processing Facility For Multi-wire Saw Cut Silicon Carbide (sic) Wafer To Epi-readyfinish in Hyderabad-T - Telangana

Tender Details

Reference # :

43264751

Description :

Tenders for Supply Of Integrated Processing Facility For Multi-wire Saw Cut Silicon Carbide (sic) Wafer To Epi-readyfinish

Ownership :

Sector :

Tender Values

Value :

NA

EMD :

NA

Doc. Cost :

NA

Important Dates

Due date :

10 Jan, 2026

Open date :

10 Jan, 2026

Publish date :

20 Dec, 2025

Location

Location :

Hyderabad-T - Telangana ( IN )

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