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Tender for Procurement Of Wirebonder Accessories - Procurement Of Wirebonder Accessories (as Per Technical Specification), Procurement Of Wirebonder Accessories (as Per Technical Specification)1) Fine Wire Bond Head (quantity: 01 No.) 4 Axis Bond Operation (x,y,z,p) For Bonding In Any Direction Quick Exchange Of Bond Head (15 Min) 17 To 75 M Wire Diameter Bond Force Programmable From 10 To 250 Cn Standard Wire Feed, 45 Wire Feed Angle (optional: 60 ) Designed For 2 Wire Spool Standard Bondtool Length Is 1 Selectable Transducer (60 Khz,100 Khz, 120 Khz And 145 Khz) 2) Standard Stereo Microscope (quantity: 01 No.) Stereo Zoom Adjustable Light Intensity 3) Bond Process Control System (quantity: 01 No.) For Individual On-line Monitoring Of Wire Deformation, Transducer Voltage, Transducer Current, Transducer Frequency Automatic Adjustment Of Ultrasonic Energy For Consistent Bond Quality Programmed Target Deformation Programmed Process Window Automatic Process Supervision Immediate Reaction On Bond Errors Graphic Recording And Display Of Each Bond Quick Set-up Of New Products Through Optical Feedback Simplified And Improved Quality Control Individual Process Documentation Per Bond Can Be Upgraded With Optional Parts Tracking in Mumbai - Maharashtra

Tender Details
Reference # :
44067114
Description :
Tenders for Procurement Of Wirebonder Accessories - Procurement Of Wirebonder Accessories (as Per Technical Specification), Procurement Of Wirebonder Accessories (as Per Technical Specification)1) Fine Wire Bond Head (quantity: 01 No.) 4 Axis Bond Operation (x,y,z,p) For Bonding In Any Direction Quick Exchange Of Bond Head (15 Min) 17 To 75 M Wire Diameter Bond Force Programmable From 10 To 250 Cn Standard Wire Feed, 45 Wire Feed Angle (optional: 60 ) Designed For 2 Wire Spool Standard Bondtool Length Is 1 Selectable Transducer (60 Khz,100 Khz, 120 Khz And 145 Khz) 2) Standard Stereo Microscope (quantity: 01 No.) Stereo Zoom Adjustable Light Intensity 3) Bond Process Control System (quantity: 01 No.) For Individual On-line Monitoring Of Wire Deformation, Transducer Voltage, Transducer Current, Transducer Frequency Automatic Adjustment Of Ultrasonic Energy For Consistent Bond Quality Programmed Target Deformation Programmed Process Window Automatic Process Supervision Immediate Reaction On Bond Errors Graphic Recording And Display Of Each Bond Quick Set-up Of New Products Through Optical Feedback Simplified And Improved Quality Control Individual Process Documentation Per Bond Can Be Upgraded With Optional Parts Tracking
Ownership :
Sector :
Tender Values
Value :
9,542,000
EMD :
190,840
Doc. Cost :
NA
Important Dates
Due date :
25 Feb, 2026
Open date :
26 Feb, 2026
Publish date :
17 Feb, 2026
Location
Location :
Mumbai - Maharashtra ( IN )
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