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Tender For corrigendum : supply of supply of lapping plates and compound d d -1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
Tender For supply of blocking diode s10 hr20 peak inverse voltage 1000v, forward current 20 amp. with insulating mounting block, copperplate & diode wire connection as per drg. no. clw/es/ sk-1/d-1/b.