Fibre Recoating System Tenders

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CTN :42411909

25 Nov, 2025 NA

Visakhapatnam - Andhra Pradesh

Tender For supply, installation, testing and commissioning of hydraulic pneumatic valve test bay valve lapping machine for the project administrative and logistic infrastructure including schools, hospitals, auditorium and sports facilitates at aob (rambilli)

Central Government And Public Sector

CTN :42305504

05 Nov, 2025 NA

Kudankulam - Tamil Nadu

Tender For supply of gate and parallel slide valve grinding and lapping machine : : - gate and parallel slide valve grinding and lapping machine size range- 15mm to 65mm , gate and parallel slide valve grinding and lapping machine size range- 80mm to 150mm , gate and parallel slide valve grinding and lapping machine size range- 200mm to 350mm , gate and parallel slide valve grinding and lapping machine size range- 300mm to 600mm , gate and parallel slide valve grinding and lapping machine size range- 500mm to 1800mm

CTN :42309668

05 Nov, 2025 NA

Visakhapatnam - Andhra Pradesh

Tender For procurement of valve lapping machine

Central Government/Public Sector

CTN :42031369

23 Oct, 2025 NA

Sultanpur - Uttar Pradesh

Tender For corrigendum : supply of double side lapping machine with accessories

Central Government And Public Sector

CTN :42175879

28 Oct, 2025 NA

Surat - Gujarat

Tender For supply of 1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine