Sand Blasting Machine Tenders

Get complete information related to latest Sand Blasting Machine Tenders . from India at Classic Tenders. Search the best available tenders from Indian government tenders, domestic Sand Blasting Machine Tenders , private tenders, online tenders, tender invitation notice, business tender notices, online tenders and bidding Sand Blasting Machine Tenders .

Filter

Loading....

Get Tender in Email

CTN :45678822

07 Jul, 2026 NA

Hyderabad - Telangana

Tender For supply of portable sand blasting machine with accessories - portable sand blasting hopper, air compressor, abrasive garnet sand, air blaster helmet with hose, safety hand gloves, operator's safety suit, gum boot

CTN :45448900

18 Jun, 2026 NA

Jhansi - Uttar Pradesh

Tender For corrigendum : supply of washing plant pump , sand blasting machine , hand gloves , mask with cartridge , overhead protection shed for special test eqpt shock absorber for tk t 90

Central Government/Public Sector

CTN :45361550

07 Jul, 2026 NA

Kolkata - West Bengal

Tender For corrigendum : supply of benchtop dc magnetron multi-target sputtering system

CTN :45444446

30 Jun, 2026 NA

Gandhinagar - Gujarat

Tender For supply of automation mechanisms to the shutter and substrate rotation assemblies of magnetron sputtering system

Central Government/Public Sector

CTN :45361585

20 Jun, 2026 NA

Lucknow - Uttar Pradesh

Tender For supply of sand blasting machine (pressure blasting machine)

CTN :45225468

29 May, 2026 NA

Jodhpur - Rajasthan

Tender For bid to ras supply of sand blasting machine

Central Government/Public Sector

CTN :45263257

23 Jun, 2026 NA

Delhi - Delhi

Tender For supply of uhv deposition chamber - uhv chamber specification (vacuum better than 2 10-9 mbar uhv) chamber overview spherical (diameter 14 ) or equivalent square shaped uhv chamber with support frame equipped with three (3) x 2-inch magnetron sputtering sources. all cf flanges and uhv viewports/ss blanks, three (3) x 2-inch magnetron sputtering sources. each sputtering source has an individual gas inlet line for process gases. all cf flanges., substrate holder : diameter: 2 inches; heating molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature to 1000 c without rotation. rotation: substrate holder can rotate continuously, driven by a stepper motor. variable speed from 0 to 10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to the substrate surface, tilt adjustable. two sputtering sources mounted confocally at an angle relative to the substrate. base pressure: lower than 2 10 mbar (ultra-high vacuum)., vacuum pumping system: turbo molecular pump: pfeiffer hipace300 / edwards next 300 / leybold turbovac 350i with cf100 flange or equivalent with integrated controller, ion pump with controller: included to maintain uhv vacuum levels and provide clean pumping., backing pump: pfeiffer hiscroll 12 / edwards nxds 15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves : one cf100 and one cf150 manual gate valves for isolating the chamber from the pumping systems as well as throttling, vacuum gauges and measurement: one cold cathode gauge with readout capable of measuring vacuum pressures down to1 10-10 mbar for precise uhv monitoring., one capacitance manometer gauge with measurement range from 1 10-1 to 1 10 mbar for accurate pressure reading during deposition phase, gas delivery system: two independent mass flow controllers (mfcs):a. one mfc (0-100 sccm) for argon gas feeding to all three sputtering sources via high vacuum valves.b. one mfc (0-100 sccm) for nitrogen gas feeding directly into the chamber with its own high vacuum valve.gas lines for ar and n2 are physically separated to avoid cross-contamination., chamber access and viewports: 1. two view ports installed on the chamber, each equipped with manual shutters. 2. access ports for gauges, pump, gas inlet and few spares for future upgradation., baking capability: entire chamber designed to bake-out at 150 c to reduce contamination and out gassing during operation, cooling capability : water manifold with flow switch / flow meters, near uhv chamber specification: chamber overview: spherical (diameter 14 ) or equivalent square shaped uhv chamber with stand., three 2-inch magnetron sputtering sources, each with individual gas inlet. all cf flanges and uhv viewports/ss blanks., substrate holder: a. diameter: 2inches; heating : molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature (rt) to 1000 c without rotation b. rotation : substrate holder driven by stepper motor. variable speed from 0 to10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to substrate surface (tilt able preferred). two sputtering sources mounted confocally at an angle. base pressure : lower than 5 10 mbar (near uhv)., vacuum pumping system: turbo molecular pump : pfeiffer hipace 700 / edwards next 730 / leybold turbo vac 900 ix or equivalent with cf100 flange and integrated controller, suitable for near uhv vacuum., backing pump: pfeiffer hi scroll 12/edwards nxds15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves: one cf150 manual gate valve to isolate / throttle chamber from pumping system, vacuum gauges and measurement: cold cathode readout capable of dis

corporations/Associations/Others

CTN :45321329

02 Jun, 2026 NA

Roorkee - Uttarakhand

Tender For auction sale of vam chiller, as per lot annexure,tbx sand blasting machine, as per lot annexure,horizontal lathe machine, as per lot description,rim strip protector, as per lot description