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Silicon Compound Tenders

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Central Government And Public Sector

CTN :43777699 Due date: 27 Feb, 202627 Feb, 2026 NA
Tender For corrigendum : supply of supply of lapping plates and compound d d -1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine

Central Government/Public Sector

CTN :44084778 Due date: 11 Mar, 202611 Mar, 2026 NA
Tender For supply of rtv silicon compound, one component clear (in 90 ml pack) part no. rtv3145

Central Government/Public Sector

CTN :44061438 Due date: 10 Mar, 202610 Mar, 2026 NA
Tender For supply of mould releasing compound sr10ra (solvent based silicon compound) , packing size: 1 ltr only.
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