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Tender For supply of equipment for students - digital tds meter table model , flame photometer with compressor , plane table set , prismatic compass , trinocular research microscope , phase contrast , micro centrifuge 15000 rpm lcd display supplied with , vortex shaker , gel electrophoresis unit with power supply , electronic balance , variable micropipe , em by helical method , astable multivibrator using transistor , phase shift oscillator , franck-hertz argon tube experiment set , four probe method , ldr characteristics apparatus , study of amplitude modulation , study of frequency modulation , microprocessor trainer kit , lattice dynamic kit , hall effect experiment , cauchy constant experiment complete set , measurement of susceptibility , desauty bridge with bridge oscillator null detector
Tender For providing of customized amc/cmc for pre-owned products - stereomicroscope; carl zeiss discovery v - 20 stereo zoom microscope; annual maintenance contract (amc); six-monthly; no
Tender For procurement of wirebonder accessories - procurement of wirebonder accessories (as per technical specification), procurement of wirebonder accessories (as per technical specification)1) fine wire bond head (quantity: 01 no.) 4 axis bond operation (x,y,z,p) for bonding in any direction quick exchange of bond head (15 min) 17 to 75 m wire diameter bond force programmable from 10 to 250 cn standard wire feed, 45 wire feed angle (optional: 60 ) designed for 2 wire spool standard bondtool length is 1 selectable transducer (60 khz,100 khz, 120 khz and 145 khz) 2) standard stereomicroscope (quantity: 01 no.) stereo zoom adjustable light intensity 3) bond process control system (quantity: 01 no.) for individual on-line monitoring of wire deformation, transducer voltage, transducer current, transducer frequency automatic adjustment of ultrasonic energy for consistent bond quality programmed target deformation programmed process window automatic process supervision immediate reaction on bond errors graphic recording and display of each bond quick set-up of new products through optical feedback simplified and improved quality control individual process documentation per bond can be upgraded with optional parts tracking