Description :
Tenders for Supply Of Uhv Deposition Chamber - Uhv Chamber Specification (vacuum Better Than 2 10-9 Mbar Uhv) Chamber Overview Spherical (diameter 14 ) Or Equivalent Square Shaped Uhv Chamber With Support Frame Equipped With Three (3) X 2-inch Magnetron Sputtering Sources. All Cf Flanges And Uhv Viewports/ss Blanks, Three (3) X 2-inch Magnetron Sputtering Sources. Each Sputtering Source Has An Individual Gas Inlet Line For Process Gases. All Cf Flanges., Substrate Holder : Diameter: 2 Inches; Heating Molybdenum Heater Capable Of Heating Substrate (a) From Room Temperature (rt) To 800 C During Rotation And (b) From Room Temperature To 1000 C Without Rotation. Rotation: Substrate Holder Can Rotate Continuously, Driven By A Stepper Motor. Variable Speed From 0 To 10 Rpmmovement: Up / Down Vertical Movement Of Total 25mm To Adjust Substrate Position During Deposition Sputtering Geometry: One Sputtering Source Mounted Parallel To The Substrate Surface, Tilt Adjustable. Two Sputtering Sources Mounted Confocally At An Angle Relative To The Substrate. Base Pressure: Lower Than 2 10 Mbar (ultra-high Vacuum)., Vacuum Pumping System: Turbo Molecular Pump: Pfeiffer Hipace300 / Edwards Next 300 / Leybold Turbovac 350i With Cf100 Flange Or Equivalent With Integrated Controller, Ion Pump With Controller: Included To Maintain Uhv Vacuum Levels And Provide Clean Pumping., Backing Pump: Pfeiffer Hiscroll 12 / Edwards Nxds 15i / Leybold Scroll Vac 15 Plus Or Equivalent Dry Scroll Pump Used To Back Tmp, Gate Valves : One Cf100 And One Cf150 Manual Gate Valves For Isolating The Chamber From The Pumping Systems As Well As Throttling, Vacuum Gauges And Measurement: One Cold Cathode Gauge With Readout Capable Of Measuring Vacuum Pressures Down To1 10-10 Mbar For Precise Uhv Monitoring., One Capacitance Manometer Gauge With Measurement Range From 1 10-1 To 1 10 Mbar For Accurate Pressure Reading During Deposition Phase, Gas Delivery System: Two Independent Mass Flow Controllers (mfcs):a. One Mfc (0-100 Sccm) For Argon Gas Feeding To All Three Sputtering Sources Via High Vacuum Valves.b. One Mfc (0-100 Sccm) For Nitrogen Gas Feeding Directly Into The Chamber With Its Own High Vacuum Valve.gas Lines For Ar And N2 Are Physically Separated To Avoid Cross-contamination., Chamber Access And Viewports: 1. Two View Ports Installed On The Chamber, Each Equipped With Manual Shutters. 2. Access Ports For Gauges, Pump, Gas Inlet And Few Spares For Future Upgradation., Baking Capability: Entire Chamber Designed To Bake-out At 150 C To Reduce Contamination And Out Gassing During Operation, Cooling Capability : Water Manifold With Flow Switch / Flow Meters, Near Uhv Chamber Specification: Chamber Overview: Spherical (diameter 14 ) Or Equivalent Square Shaped Uhv Chamber With Stand., Three 2-inch Magnetron Sputtering Sources, Each With Individual Gas Inlet. All Cf Flanges And Uhv Viewports/ss Blanks., Substrate Holder: A. Diameter: 2inches; Heating : Molybdenum Heater Capable Of Heating Substrate (a) From Room Temperature (rt) To 800 C During Rotation And (b) From Room Temperature (rt) To 1000 C Without Rotation B. Rotation : Substrate Holder Driven By Stepper Motor. Variable Speed From 0 To10 Rpmmovement: Up / Down Vertical Movement Of Total 25mm To Adjust Substrate Position During Deposition Sputtering Geometry: One Sputtering Source Mounted Parallel To Substrate Surface (tilt Able Preferred). Two Sputtering Sources Mounted Confocally At An Angle. Base Pressure : Lower Than 5 10 Mbar (near Uhv)., Vacuum Pumping System: Turbo Molecular Pump : Pfeiffer Hipace 700 / Edwards Next 730 / Leybold Turbo Vac 900 Ix Or Equivalent With Cf100 Flange And Integrated Controller, Suitable For Near Uhv Vacuum., Backing Pump: Pfeiffer Hi Scroll 12/edwards Nxds15i / Leybold Scroll Vac 15 Plus Or Equivalent Dry Scroll Pump Used To Back Tmp, Gate Valves: One Cf150 Manual Gate Valve To Isolate / Throttle Chamber From Pumping System, Vacuum Gauges And Measurement: Cold Cathode Readout Capable Of Dis
