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Tender For leveling with stone dust chips for approach roads to the eidgah/mosque in view of ramzan festival 2026 in ward no.17, cherlapally of kapra circle-7, mmc for the year 2025-26(rs.0.90 lakhs)
Tender For leveling with gravel/stone dust chips approach roads to the eidgah/mosque in view of ramzan festival 2026 in ward no.14 kapra and ward no.15, dr.a.s.rao nagar of kapra circle-7, mmc for the year 2025-26(rs.0.85 lakhs)
Tender For supply of supply and stacking of stone chips 11.2 mm , supply and stacking of stone chips 6.7 mm , supply and stacking of sand , supply and stacking of stone chips 22.4 mm
Tender For bid to ras supply of supply and stacking of stone metal 40mm , supply and stacking of stone metal 45mm , supply and stacking of stone chips 20mm , supply and stacking of stone chips 10mm , supply and stacking of sand , supply and stacking burnt clay bricks , supply and stacking ilcb 225 x 112 x 80 cm ) /bid number: gem/2026/b/7175591 * /dated: 04-02-2026 & & / bid document1 / 15
Tender For supply of stone metal 26.50 mm , stone chips 22.40 mm , stone chips 13.20 mm , stone chips 11.20 mm , stone chips 6.70 mm , sand oblique stone dust
Tender For leveling with stone dust chips for approach roads to the eidgah/mosque in view of ramzan festival 2026 in ward no.13, vampuguda of kapra circle-7, mmc for the year 2025-26(rs.2.40 lakhs
Tender For supply of supply and stacking of stone metal chips sand d d -stone metals 63 mm , stone chips 45 mm , stone metal 40 mm , stone metal 400-9 gd , stone metal 400-1 gd , stone chips 26. 50 mm , stone chips 22. 40 mm , stone chips 20 mm , stone chips 13. 20 mm , stone chips 11. 20 mm , stone chips 10 mm , stone chips 6. 70 mm , sand
Tender For scope of work (sow) as mentioned in tender and schedule of work( 7 )items as given below ,[1] dismantling of rcc, pcc & removal of de 234.000 m3,[2] earth wrk,box cutg in all soil 454.000 m3,[3] rcc,w/down stone chips,1:1.5:3 178.000 m3,[4] pcc wrk,1:2:4 w/19mm down stonechips 30.000 m3,[5] provision,rcc,1:1:2,25mm 48.000 m3,[6] cutg,placing of ms/tmt rod 27.000 to,[7] bond coat with epoxy bonding agent 500.000 m2