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Tender For supply, installation, and commissioning of equipment, tools, and machines single nozzle 3d printer, pcb milling machine, co2 laser cutting machine, vinyl printer ,3d scanner, lathe machine cum milling, cnc router ,belt and disc sanding machine, scroll saw, wood turning lathe ,bench top drill machine , relay module , soil moisture sensor , touch sensor , rain drop sensor , flex sensor , temperature sensor , force pressure sensor , colour recognition sensor , water flow sensor , sound sensor , ir sensor array for line following , rfid reader-tags , rf modules tx& rx 315 mhz ask , stepper motor with driver board , servo motor 360 rotation , copper clad board single side , copper clad board double side , male to male breadboard jumper , female to female breadboard jumper , male to female breadboard jumper , coil winding m/c motorized , plotter printer , ham radio transceiver, antenna and related equipment , relevant software(academic licenses) mat , sensor set including sensors for home,industry,agriculture automation,medical , arduino uno boards with usb a to b cable, and jumper wires all type , nodemcu esp8266 board with usb a to b cable, wires , raspberry pi 4 boards with hdmi to mini hdmi cable, 8 gb memory card, adaptor, case , beaglebone artificial intelligence based applications , beaglebone black wireless , peripheral sets for arduino/nodemcu/raspberry pi (f-f,m-m,m-f connecting wires) , esp32 cam development board wifi bluetooth with ov2640 camera module , solnoi electonics raspberry pi 3 camera module night vision camera , ets think z kit , outdoor lorawan gateway , etz thinkzkit: iot think z kit, iot controllers , lorawan i/o controller
Tender For supply of msr252642 d d-- adc dac fmc pcb fabrication, assembly , bom procurement c106.28.3800 00a details as per the annexure1 , l band receiver pcb fabrication , assembly , bom procurement c106.28.7800 00a details as per the annexure1 , l band exciter pcb fabrication, assembly , bom procurement c106.28.7900 00a details as per the annexure1 , vu pa interface pcb fabrication, assembly , bom procurement c106.28.6000 00a details as per the annexure1 , cpu pcb fabrication, assembly , bom procurement c106.17.6400 00a details as per the annexure1 , vuhf control pcb fabrication, assembly, bom procurement c106.28.2300 00a details as per the annexure1 , rf power supply pcb fabrication, assembly, bom procurement c106.28.1500 00a details as per the annexure1 , motherboard pcb fabrication , assembly , bom procurement c106.28.0400 00 details as per the annexure1 , fp pcb fabrication, assembly , bom procurement c106.28.0900 00 details as per the annexure1 , digital power supply pcb fabrication , assembly , bom procurement c106.28.1100 00 details as per the annexure1 , pre driver pcb fabrication, assembly , bom procurement c106.28.5600 00 details as per the annexure1 , driver pcb fabrication, assembly , bom procurement c106.28.5700 00 details as per the annexure1 , pa alc pcb fabrication, assembly , bom procurement c106.28.5800 00 details as per the annexure1 ) /bid number : gem/2025/b/6705622 * /dated: 19-09-2025 & & / bid document 1 / 15