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corporations/Associations/Others

CTN :41022619 Due date: 15 Jul, 202515 Jul, 2025 NA
Tender For procurement of components - chip ferrite bead 10uh, 180 ohms, 1.5a, smd, 0603, p/n: blm18pg181snid, make: murata electronics, multilayer ceramic capacitors 18pf, 5%, 50v. smd, 0805, p/n: 0805n180j500ct. make: walsin, inductors for decoupling circuits multilayer ferrite 10uh, 20%, 0.1a, smd, 2.0x1.25x1.25 mm, p/n: mlz2012n100lt00, make: tdk/murata, general purpose plastic rectifier, smd, sod-123fl, p/n: 1n4007fltr, make: smc diode solutions, tvs diodes axial leaded 500w, thru hole, p/n: sa24a, make: littel fuse, protection diodes, thru hole, p/n: sa5a, make: multicomp, precision thin film chip resistor 500 ohms. 0.01%, 200mw, smd, 0805, p/n: rncf0805tky500r, make: sei stackpole, inc, high precision thin film chip resistor 3.1k ohms, 0.1%, 1/10w, smd 0805, p/n: mcwf08u3101btl, make: multicomp, precision thin metal film flat chip resistors 5k ohms, 0.1%, 1/4w, smd, p/n: rn73r2bttd5001b25, make: koa speer, 32-bit arm cortex-m4/m0 based microcontrollers, smd lqfp208, p/n: lpc4357jbd208k, make: nxp semiconductors, 1-mbit serial i square c bus eeprom, smd so 8 pin, p/n: m24m01-rmn6p, make: stm, 128 mbit (16 mbyte), 256 mbit (32 mbyte) 3.0v spi flash memory, smd soic 16, p/n: s25fl256sagmfi011, make:, infineon, 3.0 a, 15 v, step down switching regulator, smd, d2pak, p/n: lm2576d2t-adjg, make: on semiconductor, micro miniature push button switch, smd, p/n: 5-1437565-0, make: te connectivity, smd crystal, rtc 32.768khz, p/n: abs07-32.768khz-9-t. make: abracon, ultra miniature ceramic glass sealed smd crystal, smd crystal, p/n: abm8g-12.00mhz-18-d2y-t, make: abracon, micro sd memory card connector, smd, p/n: mem2061-01-188-00-a, make: global connector tech, battery holder for cr1225, smd, p/n: 1072, make: keystone, asymmerical tvs diode for extended common-mode rs-485, smd sot-23, p/n: sm712.tct, make: semtech, npn silicon planar high performance transistor, smd, sot23, p/n: fmmt455ta, make: diode incorporated, signal relay_dpdt, 5vdc, 2a, thru hole smt, p/n: im03ts, make: te conectivity, battery holder for cr1225, smd, p/n: 1072, make: keystone, asymmerical tvs diode for extended common-mode rs-485, smd sot-23, p/n: sm712.tct, make: semtech, npn silicon planar high performance transistor, smd, sot23, p/n: fmmt455ta, make: diode incorporated, signal relay_dpdt, 5vdc, 2a, thru hole smt, p/n: im03ts, make: te conectivity, red surface mount chip leds, smd, 0603, p/n: sml-d12u8wt86c, make: rohm, schottky diodes & rectifier, smb p/n: b360b make: diodes incorporated, memory card micro sd 1gb slc, p/n-ap-msd01gisi-t, make: apacer, general purpose thick film chip resistor 1k, 5%, 1/8w, smd 0603, p/n: rk73b1jttd102j, make: koa speer electronics, 20 position ffc/fpc cable, 1.0mm pitch, cable mount, p/n: 15039-0357, make: molex, 20 position ffc/fpc connector contacts, 1.0mm pitch right angle, smd, p/n: 522072060, make: molex, character oled display module, 4 lines x 20 characters, p/n: nhd-0420cw-ab3, make: newhaven display international, inc

CTN :41010621 Due date: 19 Jul, 202519 Jul, 2025 11.00 Lacs
Tender For providing of design installation and maintenance of educational lab - ict lab; supply and installation of hardware; buyer - intel core 19-13900 (1.5 ghz e-core hase frequency, 2.0 ghz p-core base frequency, up to 4.2 gh, intel q670 (vpro), all-in-one, 64 gb ddr5-5600 sdram transferrates up to 5600 mt/s., 2 sodimm, 1 tb pcie nvme tlc m.2 ssd, 68.6 cm (27) diagonal, qhd (2560 x 1440), touch, ips, 250 nits, 72% ntsc, nvidia geforce rtx 3050 ti (4 gb gddr6 dedicated, audio by bang & olufsen, 5 w stereo speakers, headset and headphone side ports (3.5 mm), high performance integrated stereo speakers, 1 m.2 2230; 3 m.2 2280 (1 m.2 2230 slot for wlan and bluetooth combo. 3 m.2 2280 for nvme ssd for storage one attached to cpu pcie gen 4.0 and two attached to pch pcie gen 3.0), left side: 1 headphone/microphone combo: right side: 1 usb type-c 20gbps signaling rate (charging); 1 usb type-a 10gbps signaling rate; rear. 1 usb type-c 10gbps signaling rate; 2 usb type-a 10gbps signaling rate, 2 usb type-a 5gbps signaling rate; 1 hdmi-in 1.4; 1 dual-mode displayport 1.4; 1 rj-45, lan: intel 1219-lm pcie gbe nic, vpro, intel wi-fi 6e ax211 (2x2) and bluetooth" 5.3 wireless card, vpro, 5 mp swivel camera with temporal noise reduction and integrated dual array digital microphones, trusted platform module tpm 2.0 embedded security chip shipped with windows 10 (common criteria eal4+ certified)(fips 140-2 level 2 certified);, fingerprint reader, 15-in-1 50 media card reader, 240 w internal power supply, up to 92% efficiency, active pfc, epeat registered with climate+, tco 8.0: tuv low blue light, tuv low noise, microsoft office bussiness, antivirus - eps console, mii,

corporations/Associations/Others

CTN :40965354 Due date: 18 Jul, 202518 Jul, 2025 NA
Tender For supply of components as per specifications and qty mentioned in bom to ecil-hyderabad. - cry.osc, smd, 5x7mm,16.384,c57xh-16.384m-3-50cs1-tr(4tech), cry.osc, smd, 24mhz,3.3v,-40to+85,5x7mm, cry.osc, smd, 50mhz, 3.3v,-40to+85,5x7mm,, crystal osci., smd,32mhz, 3.3v,25ppm, industrial grade., cry osc, smd, 125mhz, 3.3v, 5x7mm,indus,dfns11-llpi fordahl, cry.osc, smd, 5x7mm,25mhz,25ppm,3.3v,cwx813-025.0m(con-win, crystal, tun.fork, 32.768khz, 5ppm, 12.5pf,-20-60c,r38(raltr, fuse, chip, smd, 1206, fast-blow,10a,tr/3216ff10-r(bussmann), magnetic module (lan filter), smd, soic16, hx1188nl(pulse)., polyfuse resettable ptc, smd, 1206l050-c(littelfuse), conn, 10 pin, fh12-10s-0.5sh(55) (hirose)., connector, smd, 14pin, fh12-14s-0.5sh (hirose)., conn,hdr, wafer, ramp,st, 2.50mm, 3pin,p9052529-19-3(protect, conn, hdr, wafer, ramp, st, 2.50mm, 8pin, p9052s29-19-8(protect, conn,hdr, wafer, ramp,st, 2.50mm, 16pin, p9052s29-19-g(protec, conn, hdr, wafer ramp, 6pin, st.2.5mm,p9052s29-19-6(protect), conn,hdr, wafer ramp,r/a,2.50mm,2pin,p9052r29-19-2(prote, conn, type a, female,r/a,110 contacts,064176/354142(erni), conn, type b,female,r/a,110 contacts, 064785/354148 (erni), conn, female coding key for type a conn,2348,043337(erni), conn, rj45, jack, 8p8c, tab down, shielded, 615008140121(wurth, conn,rj45, fast jack, gigabit ether,hfj11-1g01e-l12rl(halo, conn, shrouded hdr, 2row,r/a,spin,90130-31-08 (molex), transistor, mmbt 3904lt1, sot-23 (mot) (1am)., led, smd 0603, yellow green, kl191ygx (cosmo)., diode, schottky, 1a, 40v, 1n5819,d0-41(khandelwal/motorola), pulseguard esd suppressor, smd, 0603, pgb1010603(littelfuse, mosfet,n channel, 30v,63a,d pak, irlr8103vtrpbf (ir)., led smd,bi-colour, red/green, 4 pin,2.1v,hsmf-c155., diod, schottky rectifier, mbr0530t1,sod-123 (on semi) (b3)

CTN :40949707 Due date: 25 Jul, 202525 Jul, 2025 NA
Tender For supply of alphanumeric lcd display-model name 40 x 4 rd040004a340 x 4 alphanumeric lcd display module chip onboard cobfstn white, make- royal display or equivalent

CTN :40961187 Due date: 25 Jul, 202525 Jul, 2025 NA
Tender For supply of alphanumeric lcd display-model name 40 x 4 rd040004a3 40 x 4 alphanumeric lcd display module chip on
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