Tender For supply of fuser assy 1020 , head printer , head carriage , power supply card , mother board , processor intel core i 5 10 gen , printer head epson l3110 , ink pad
Tender For corrigendum : cwek/token-134/864 ews/2025-26 additional/alteration of existing chs pipe line and its connected accessories from plant room to gym hall in the aor of age e/m under ge 864 ews (job no w/rev-09/bb cantt/2025-26)
Tender For corrigendum : supply of 10 hp vrf outdoor unit , 12 hp vrf outdoor unit , 14 hp vrf outdoor unit , 0.8 tr indoor unit , sitc of 1.0 tr indoor unit , sitc of 1.6tr indoor unit , sitc of 2.0 tr indoor unit , sitc of 2.6 tr indoor unit , sitc of 3.2 tr indoor unit , sitc of 4.0 tr indoor unit , sitc 4.6 tr indoor unit , supply installation testing and commissioning of wireless remote controller , sitc of following copper fittings to be provided in refrigerant pipe line t joint , sitc of following copper fittings to be provided in refrigerant pipe out door connection kit , supply of 1.9 tr inverter ttpe split ac with wireless remote , supply of 1.5 tr inverter ttpe split ac with wireless remote , copper pipe 41.3 mm , copper pipe 34.9 mm , copper pipe 28.6 mm , copper pipe 22.2 mm , copper pipe 19.1 mm , copper pipe 15.9 mm , coper pipe 12.7 mm , copper pipe 9.5 mm , copper pipe 6.4 mm , normal split copper pipe , pvc drain pipe 25mm dia , pvc drain pipe 32 mm dia , pvc drain pipe 40 mm dia , sitc of microprocessor based communication cable , hot dipped gi perforated 20 guage tray 450mmx75mm x 1.6mm thickness , hot dipped gi perforated 20 guage tray 300 mmx75mm x 1.6mm thickness , hot dipped gi perforated 20 guage tray 200 mmx75mm x 1.6mm thickness , hot dipped gi perforated 20 guage tray 150 mmx75mm x 1.6mm thickness
Tender For bid to ras providing of facility management services - lumpsum based - soil investigation; soil investigation; consumables to be provided by service provider (inclusive in contract cost)