Semi Conductor Laboratory Tenders - SL Tenders

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State Government

CTN :45206049

15 Jun, 2026 NA

Rupnagar - Punjab

Tender For procurement of test wafer n-type for implant

State Government

CTN :45206005

11 Jun, 2026 NA

Rupnagar - Punjab

Tender For rate contract for the assembly of epoxy probe cards for two years

State Government

CTN :45171181

20 May, 2026 NA

Rupnagar - Punjab

Tender For inductor 150nh 150mhz, tol 2 percent make coilcraft (0603cs150 x glc)

State Government

CTN :45129690

08 Jun, 2026 NA

Rupnagar - Punjab

Tender For rate contract for packages & lids - spares for dicing saw (disco, dad 3660), ceramic ic package - 8 pin csop (die cavity 3.3mm x 3.3mm), ceramic ic package - 14 pin csop (die cavity 3.81mm x 3.81mm), sealing lid with perform; drawn od 250mils x 250mils id 210mils x 210mils, ceramic ic package -14pin csop (die cavity 6.47mm x 3.96mm), sealing lid with perform; drawn od 380 mils x 245mils, id 0340mils x 215mils, ceramic ic package - 16pin csop (die cavity 4.19mm x 3.81mm), sealing lid with preform: drawn od300 mils x 250mils id 250mils x 205mils, ceramic ic package 22 pin cdip, die cavity: 7.11mm x 6.6mm, sealing lid with preform (lwp) - od407 x 370 id 410 x 345, ceramic ic package - 24 pin cqfp (die cavity 8mm x 8mm), sealing lid with preform: od476 mils x 476 mils id 445 mils x 445 mils, ceramic ic package 28 pin cdip, die cavity: 5.58mm x 5.58mm, sealing lid with preform: od493 mils x 493 mils id 423 mils x 423mils, ceramic ic package - clcc 28 pin (cavity size 5mm sq), sealing lid with step for seam sealing od 9.11mm sq, ceramic ic package - clcc 44pin (cavity size 6.35mm sq), sealing lid with step for seam sealing od 11.4mm sq, ceramic ic package clcc 44 (cavity 12mm x 12mm), sealing lid with preform od 620" id 570", ceramic ic package - 48 pin cdfp ( dia cavity 4mm x 5.3mm), ceramic ic package - 48 pin cdep (die cavity 4 mm x 8.65 mm), sealing lid with preform: lwp od 472mils x 360mils, id420mils x 308mils, ceramic ic package - 64 pin cqfp (die cavity 5.6 mm x 5.6 mm), sealing lid with preform: lwp od 362 mils x 362 mils, id 323 mils x 323 mils, ceramic ic package clcc 68 pin (cavity size 8.12mm sq), sealing lid withstep for seam sealing od 12.42 mmsq, ceramic ic package 68 pin cqfj, (die cavity: 8.255 mmx 8.255mm), sealing lid with preform (lwp)-od 590mils x 590mils id 520mils x 520mils), ceramic ic package clcc 84 pin (cavity size 8.89 mm sq), sealing lid withstep for seam sealing od 16.48 mm sq, ceramic ic package 100 pin cerquad lead frame , (die cavity: 8.99 mmx8.99 mm), sealing lid with frit glass ceramic od:787x551 mils id 689 x 449mls, ceramic ic package - 132 pin cqfp (die cavity 10.16 mm x 10.16 mm), ceramic ic packge132 pin cqfp ((die cavity: 11.4 mm sq ), sealing lid with preform: lwp od 710 mils x 710 mils, id 660 mils x 660 mils, ceramic ic package 208 pin cqfp , (die cavity: 9.5 mm x 9.5 mm), ceramic ic package 208 pin cqfp , (die cavity: 12 mm x 12 mm), sealing lid with step for seam sealing od 20.6 mmsq, ceramic ic package 256 pin cqfp, die cavity: 16.5 x 16.5, sealing lid with preform: lwp od: 867x867, id: 803x803 mils, ceramic ic package 20 pin cdfp, die cavity: 6.350 x 3.556, sealing lid with preform lwp od460x280 id420x240, ceramic ic package - 10 pin csop (die cavity 3.3mmsq)