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Tender For bid to ras bid to ras bid to ras bid to ras corrigendum : supply of dclc solutions for hpc testbed cluster cdac pune - cooling distribution unit rack based with primary and secondary connection kit, hose, flange etc. , under floor piping work and connection to cdus and manifolds along with grooved fittings etc. , supply and return manifold 42u with 36 nodes each side , coldplate pair suitable for intel sapphire-emerald rapids. along with tube of appropriate length with quick disconnect dripless connectors , coolant for secondary network , any other items -components required to complete the scope , any other charges required to complete the dclc solutions in total. , charges towards - installation, commissioning, testing etc.
05 Jun, 2025
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