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Tender For providing three phase 100 kva electrical supply to radiography unit, from substation or feeder pillar and providing/installation of 5 ground earthing of 1 ohms, at the radiography unit (copperplate earthing) at rvp ivri, izzatnagar, bareilly. (sh: electrical works)
Tender For supply of 1600050033 coupling key moc en8 part no 3250 , 1600050034 impeller key moc en8 part no 3200 , 1600050036 sleeve nut lh moc ss410 part no 3031 , 1600050035 sleeve nut rh moc ss410 part no. 3032 , 1600050037 oil ring moc brass part no 2820 pumps , 1600050198 dust cover moc aluminium part no 2791 , 1600050199 bearing housing de and nde moc ci part no 2760 , 1600050200 bearing bush moc ltb2 part no 2700 , 1600050201 gland moc ci part no 2311 , 1600050202 suction sleeve moc ss 410 part no 2103 , 1600050203 delivery sleeve moc ss 410 part no 2102 , 1600050204 combined seating and bush moc ci part no 2082 , 1600050205 partition plate moc ci part no 2074 , 1600050206 water deflector moc rubber part no 2070 , 1600050207 balance valve moc bronze part no 1900 , 1600050208 shaft moc en8 part no 1800 , 1600050209 impeller moc ci part no 1500 , 1600050210 suction plate moc ci part no 1191 , 1600050211 neck bush moc ci part no 1102 , 1600050212 neck ring moc ci part no 1181
Tender For supply of supply of lapping plates and compound d d -1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copperplate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
Tender For corrigendum : supply of base for deflector plate drg. no. s-swg/gzb/p&r/d.p/1 as per is:2062 (2011) or latest & is: 3954:1991 rev.1 or latest. [ warranty period: 30 months after the date of delivery ]
Tender For corrigendum : tender for supply of machining and supply of parts from hal supplied raw material and technology - deflector , plank , clamping , plate , rib
Tender For hoisting of vhf fm 4-bay dipole antenna, construction of horizontal rf cable tray, laying of rf air dielectric co-axial cable from antenna to transmitter and construction of copperplate earthing (03 nos.) for 1 kw fm transmitter (50m ss tower) at akashvani namsai (arunachal pradesh).