Diamond Lapping Compound Tenders

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State Government

CTN :42289445

21 Oct, 2025 NA

Thiruvananthapuram - Kerala

Tender For purchase of anti plgf antibody (ab196666) ,2-amino terephthalic acid ,mucin 16 polyclonal antibody (itt2922 ,isophthalic acid ,dopamine hydrochloride, tris(2,2'- bipyridyl)dichlororutheniu m(ii) hexahydrate ,2,6- naphthalenedicarbo xylic acid ,1, 2, 4, 5- benzenetetracarbox ylic acid (pyromellitic acid) ,2, 2':6", 2"-terpyridine]- ,4'-carboxylic acid ,5-boronoisophthalic acid ,europium oxide , terbium oxide , hafnium oxide , zirconium oxide , barium carbonate , sodium carbonate , manganese oxide , tellurium oxide , copper oxide , neodymium oxide , erbium oxide , gadolinium oxide , dysprosium oxide , 9-fluorenone 2-carboxylic acid , ammonium fluoride , sodium hexafluoroacetylacetonate , 2-thenoyltrifluoroacetone , triphenylphosphine oxide , 4'-chloro-2,2':6',2"- , terpyridine

Central Government And Public Sector

CTN :42175879

28 Oct, 2025 NA

Surat - Gujarat

Tender For supply of 1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine

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