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Digital Line Card Tenders

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Bid Submission Date Range
Tender Value

CTN :45614171 Due date: 06 Jul, 202606 Jul, 2026 3.50 Lacs
Tender For corrigendum : ecv system service visit - multiple outlet socket, saturated calomel electrode, large sealing ring for cvp21 measurement, calibration wafer cvp21 silicon high

Central Government/Public Sector

CTN :45566462 Due date: 07 Jul, 202607 Jul, 2026 NA
Tender For supply of sputtering target of nickel , sputtering target of carbon , sputtering target of boron carbide , sputtering target of tungsten , silicon wafer of 2 inch diameter , silicon wafer of 3 inch diameter

CTN :45450277 Due date: 27 Jun, 202627 Jun, 2026 NA
Tender For supply of silicon wafer

Central Government/Public Sector

CTN :45244516 Due date: 28 May, 202628 May, 2026 NA
Tender For silicon wafer fz ntd bhd r62 silicon wafer fz ntd 125mm dia 600um thk

corporations/Associations/Others

CTN :45251585 Due date: 29 May, 202629 May, 2026 NA
Tender For providing of customized amc/cmc for pre-owned products - --; nec sv9100; annual maintenance contract (amc); quarterly; yes - nec make hybrid epabx system (model sv9100), nec make ip gateway card for 48 channels, nec make digital line card for 08 ports, nec make voice mail system 4 port for use with pc, main distribution frame (mdf) (100 pair), nec make operator console (digital phone), nec make isdn pri card, nec ipbx system, model sv-9100, nec ip phone 6 button, sip phone, entire intercom network consisting of intercom sets, digital phones, plan sets, all p&t sets, fct sets, main distribution boxes, cables.

CTN :45033611 Due date: 21 May, 202621 May, 2026 NA
Tender For supply of p type silicon wafer

CTN :44970065 Due date: 15 May, 202615 May, 2026 NA
Tender For supply of 6 inch 300 micron thin p-type silicon wafer as per uploaded annexure-i & compliance sheet
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