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Gun Powder Tenders

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CTN :42074767 Due date: 25 Oct, 202525 Oct, 2025 NA
Tender For corrigendum : supply of gun powder g-7, to specn. no. jss 1376-05-2024 rev. no. 5 dc-6697-me (l. f. no. 1002108007)

CTN :42194182 Due date: 29 Oct, 202529 Oct, 2025 NA
Tender For supply of gun powder g-12 to specn. no. jss: 1376-05: 2024 (revision no. 5) nsn no. 1376-720-302010 dc no. 6697-

Central Government And Public Sector

CTN :42175879 Due date: 28 Oct, 202528 Oct, 2025 NA
Tender For supply of 1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
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