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Tender For supply of brass sieve set of size 10 mm, 6.3 mm or 5.0 mm, 5.6 mm, 4.75 mm, 4 mm, 1 mm, 0.5 mm& 0.106 mm, for sieve analysis of miscellaneous consumables like hddrm, dolomite, graphite powder etc. . the sieves should be of brass frame, of 200 mm diameter and 50 mm height., should meet the requirement of is- 410 part 1. the calibration certificate for size conformity to be obtained from a nabl approved laboratory with scope for the same. sieves should be of minimum 0.6 mm thickness gauge, and a minimum weight of 320 gms each. brass sieves should be without any joint machine made, uniformly fabricated with ss cloth, individually packed in printed cardboard boxes. warranty-1 year. the whole sieve set will be rejected even if a single sieve is not meeting the above requirement. if any sieve is damaged within warranty period, the supplier has to replace the same, on no payment basis. [ warranty period: 12 months after the date of delivery ] ]
Tender For supply of brass sieve set of size astm 8, 10, 12, 14, 16, pan with lid (lid should be with ring and not head)., for steel shots sieve analysis. the sieves should be of brass frame, of 200 mm diameter and 50 mmheight., should meet the requirement of is- 410 part 1. the calibration certificate for size conformity to be obtained from a nabl approved laboratory with scope for the same. sieves should be of minimum 0.6 mmthickness gauge, and a minimum weight of 320 gms each. brass sieves should be without any joint machine made, uniformly fabricated with ss cloth, individually packed in printed cardboard boxes. warranty-1 year. the whole sieve set will be rejected even if a single sieve is not meeting the above requirement. if any sieve is damaged within warranty period, the supplier has to replace the same, on no payment basis. [ warranty period: 12 months after the date of delivery ] ]
Tender For all in one pc preloaded with windows 11 professional and microsoft office 2024 with the following specifications: processor: intel i3-12100 or amd ryzen 3 5300g or higher; ram: minimum 16 gb ddr4/ddr5 or better with at least one free slot for future upgrades; motherboard/chipset: intel q670 or equivalent/higher and must be compatible with motherboard; graphics: integrated graphics; storage: 512gb pcie nvme m.2 tlc opal ssd or higher; display: minimum 23.8-inch or higher fhd ips anti-glare display with 1920x1080 resolution, 250 nits brightness or higher, 16:9 aspect ratio; webcam: integrated webcam with ir sensor and minimum 5 mp resolution with dual microphonearray; speakers: internal stereo speakers, 3w x 2 with dual microphone array or higher; connectivity: integrated gigabit ethernet rj45 (10/100/1000), wi-fi 6e (802.11ax, 2%d72 mimo), bluetooth 5.3 or higher; ports: minimum 1 x hdmi, 1 x dp, 1 x usb type-c, and minimum 3 x usb type-a 3.0 or higher; power supply: must have an efficiency of >85%; stand: fully functional stand with tilt, swivel, and height adjustment; peripherals: oem wireless usb keyboard and mouse, both embossed with the same oem logo and free from any brand stickers or pasting; warranty: 3 years comprehensive onsite warranty by oem. [ warranty period: 36 months after the date of delivery ] ]
Tender For rfp for hardware augmentation of banks vm infrastructure- make, model, form factor, cpu, chipset, mother aard, disk drives, cache, usb port, cooing fans, ram, bus slots, diagnost ics, security, os support, systems manage merit and diagnost ics, certifica on and ndustry tandar s complia t, network port, hba's for fc connect equired, power upply, delivery, warrant , industrial, standar , complia nce