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Tender For supply of uhv deposition chamber - uhv chamber specification (vacuum better than 2 10-9 mbar uhv) chamber overview spherical (diameter 14 ) or equivalent square shaped uhv chamber with support frame equipped with three (3) x 2-inch magnetron sputtering sources. all cf flanges and uhv viewports/ss blanks, three (3) x 2-inch magnetron sputtering sources. each sputtering source has an individual gas inlet line for process gases. all cf flanges., substrate holder : diameter: 2 inches; heating molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature to 1000 c without rotation. rotation: substrate holder can rotate continuously, driven by a stepper motor. variable speed from 0 to 10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to the substrate surface, tilt adjustable. two sputtering sources mounted confocally at an angle relative to the substrate. base pressure: lower than 2 10 mbar (ultra-high vacuum)., vacuum pumping system: turbo molecular pump: pfeiffer hipace300 / edwards next 300 / leybold turbovac 350i with cf100 flange or equivalent with integrated controller, ion pump with controller: included to maintain uhv vacuum levels and provide clean pumping., backing pump: pfeiffer hiscroll 12 / edwards nxds 15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves : one cf100 and one cf150 manual gate valves for isolating the chamber from the pumping systems as well as throttling, vacuum gauges and measurement: one cold cathode gauge with readout capable of measuring vacuum pressures down to1 10-10 mbar for precise uhv monitoring., one capacitance manometer gauge with measurement range from 1 10-1 to 1 10 mbar for accurate pressure reading during deposition phase, gas delivery system: two independent mass flow controllers (mfcs):a. one mfc (0-100 sccm) for argon gas feeding to all three sputtering sources via high vacuum valves.b. one mfc (0-100 sccm) for nitrogen gas feeding directly into the chamber with its own high vacuum valve.gas lines for ar and n2 are physically separated to avoid cross-contamination., chamber access and viewports: 1. two view ports installed on the chamber, each equipped with manual shutters. 2. access ports for gauges, pump, gas inlet and few spares for future upgradation., baking capability: entire chamber designed to bake-out at 150 c to reduce contamination and out gassing during operation, cooling capability : water manifold with flow switch / flow meters, near uhv chamber specification: chamber overview: spherical (diameter 14 ) or equivalent square shaped uhv chamber with stand., three 2-inch magnetron sputtering sources, each with individual gas inlet. all cf flanges and uhv viewports/ss blanks., substrate holder: a. diameter: 2inches; heating : molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature (rt) to 1000 c without rotation b. rotation : substrate holder driven by stepper motor. variable speed from 0 to10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to substrate surface (tilt able preferred). two sputtering sources mounted confocally at an angle. base pressure : lower than 5 10 mbar (near uhv)., vacuum pumping system: turbo molecular pump : pfeiffer hipace 700 / edwards next 730 / leybold turbo vac 900 ix or equivalent with cf100 flange and integrated controller, suitable for near uhv vacuum., backing pump: pfeiffer hi scroll 12/edwards nxds15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves: one cf150 manual gate valve to isolate / throttle chamber from pumping system, vacuum gauges and measurement: cold cathode readout capable of dis
Tender For supply of different types of spares for filed instruments on rate contract basis for 03 (three) years at head water works. - transmitter (display unit) for open channel flow/loh-rof/level meter, transmitter (display unit) for level meter, range: 30 mtr, transducer for loh/rof/level/open channel flow transmitter, range: 8 mtr, transducer for level/open channel flow transmitter, range: 10 mtr, transducer for level transmitter, range: 30 mtr, level meter(integrated)/loh-rof, range: 6 mtr, level meter(integrated), range: 12 mtr, pressure transmitter (peizo resistive), sensor for insertion type ultrasonic flow meter, transmitter insertion type ultrasonic flow meter, sensor cable for insertion type ultrasonic flow meter, pcba for fus060 siemens flow meter, flow indicating totalizer, receiving indicators, limit switch, auto drain valve, pressure transmitter (flush diaphragm), sealed lead acid battery for ups, cap: 12 v 42 ah, selec make dtc204 temp controller, constant voltage transformer, pressure gauge 0 - 4 kg/cm2, pressure gauge 0 - 7 kg/cm2, offline ups 0.6 kva, online ups 1 kva with 1 hour back up including batteries & battery rack, online ups 3 kva with 1 hour back up including batteries & battery rack
Tender For procurement for asco make spares for fgdash handling system and boilerat ntpc khargone 2660mw - solenoid valve,x531506151002h1,asco, sol v/v,x531506151004h1,asco, repair kit,c312192,asco, sol v/v,asco,scht8320a202, sol v/v,d118s03-z610a,asco, valve,sol,direct acting,dual,nc,24v, valve,sol,direct acting,single,no/nc, valve,sol,pilot oper,single,no/nc,240vac, vv,sol: pilot oper,single,nc, swch: 11-61228-00,24 vdc,3a,spdt,surface