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Tinplate Tenders

Get complete information related to latest Tinplate Tenders . from India at Classic Tenders. Search the best available tenders from Indian government tenders, domestic Tinplate Tenders , private tenders, online tenders, tender invitation notice, business tender notices, online tenders and bidding Tinplate Tenders .

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State Government

CTN :42309327 Due date: 17 Oct, 202517 Oct, 2025 NA
Location: Multi City - Maharashtra Multi City - Maharashtra
Tender For auction sale of metallic, non-metallic - auction of aluminium, iron, tinplate, brass, copper, steel, and other scrap material

CTN :42238985 Due date: 20 Oct, 202520 Oct, 2025 1.03 Lacs
Location: Kapurthala - Punjab Kapurthala - Punjab
Tender For repair of valve plate replace , repair of bearing plate replace , repair of piston set replace , repair of platte lapping , overhaul repair of all seal kit set , repair seal carrier lock

Central Government And Public Sector

CTN :42175879 Due date: 28 Oct, 202528 Oct, 2025 NA
Location: Surat - Gujarat Surat - Gujarat
Tender For supply of 1. cast iron plain hand lapping plate -dia- 6 inch- 30 mm thick , 2. cast iron plain hand lapping plate -dia- 12 inch- 30 mm thick , 3. cast iron plain hand lapping plate -dia- 18 inch- 30 mm thick , 4. copper hand polishing plate mounted on ms base plate -dia- 6 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 5. copper hand polishing plate mounted on ms base plate -dia- 12 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 6. copper hand polishing plate mounted on ms base plate -dia- 18 inch- 30 mm thick. 10 mm thick of copper plate and 20 mm thick base plate , 7. diamond lapping compound having grades of grain size 10 microns and packing in 5 gms of syringe , 8. diamond lapping compound having grades of grain size 15 microns and packing in 5 gms of syringe , 9. diamond lapping compound having grades of grain size 25 microns and packing in 5 gms of syringe , 10. diamond lapping compound having grades of grain size 45 microns and packing in 5 gms of syringe , 11. diamond lapping compound having grades of grain size 70 microns and packing in 5 gms of syringe , 12. diamond lapping compound having grades of grain size 90 microns and packing in 5 gms of syringe , 13. lapping abrasive liquid having grain size of 03 microns suitable for use in electrically operated lapping machine
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