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Tender For supply of push rod , valve butterfly 4 inch , acceleration wire , fly wheel , reduction pre selector , door filling lh , door filling rh , door regulator handle , door handle lh , window regulator , free cylinder , control cylinder , clutch plate 430 gtz 491862521 , clutch cover , alternator 28 55a , starter , wiper swf 107799 , main cylinder , pl valve , air dryer , clutch booster , c sump , electro pump , circuit breaker 9432020 , relay 24v 25amp , priming pump kit , valve ball 100 nb ss , valve butterfly 150 nb ci , actuator rotary double acting ec 50 rotex , actuator rotary double acting ec 63 rotex , gauge compound vaccum dial indicating make h guru 100mm range 1 to 24kg per cm2 , gauge pressure dial indicating make h guru 100mm range 0 to 25 kg per cm2 , fuel fine filter , steering filter , gasket fuel filter , air filter element , air filter element inner , lubricant oil filter , sealing ring 137x5 sil 0707m202 oil filter , fuel pre filter , cone belt fan , protective tube , hand pump , gang of electro pneaumatic valve
Tender For operation and maintenance of deep tubewellpump motor set at block-ij (new), rr plot, opp. crs, rr plot market, nonadanga-i and nonadanga-ii tubewell stations at eastern side of e.m. bypass of east kolkata for a period of 12 months.
Tender For corrigendum : construction of oht tubewellpump house, laying and jointing rising main and distribution systems all ancillary civil and electro mechanical works of subhash nagar bharuwala grant water supply scheme under uidf programme
Tender For corrigendum : repair of oht construction of tubewellpump house laying and jointing rising main and distribution systems consisting of proper completion of the work of clement town cantt water supply scheme under uidf programme
Tender For supply of uhv deposition chamber - uhv chamber specification (vacuum better than 2 10-9 mbar uhv) chamber overview spherical (diameter 14 ) or equivalent square shaped uhv chamber with support frame equipped with three (3) x 2-inch magnetron sputtering sources. all cf flanges and uhv viewports/ss blanks, three (3) x 2-inch magnetron sputtering sources. each sputtering source has an individual gas inlet line for process gases. all cf flanges., substrate holder : diameter: 2 inches; heating molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature to 1000 c without rotation. rotation: substrate holder can rotate continuously, driven by a stepper motor. variable speed from 0 to 10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to the substrate surface, tilt adjustable. two sputtering sources mounted confocally at an angle relative to the substrate. base pressure: lower than 2 10 mbar (ultra-high vacuum)., vacuum pumping system: turbo molecular pump: pfeiffer hipace300 / edwards next 300 / leybold turbovac 350i with cf100 flange or equivalent with integrated controller, ion pump with controller: included to maintain uhv vacuum levels and provide clean pumping., backing pump: pfeiffer hiscroll 12 / edwards nxds 15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves : one cf100 and one cf150 manual gate valves for isolating the chamber from the pumping systems as well as throttling, vacuum gauges and measurement: one cold cathode gauge with readout capable of measuring vacuum pressures down to1 10-10 mbar for precise uhv monitoring., one capacitance manometer gauge with measurement range from 1 10-1 to 1 10 mbar for accurate pressure reading during deposition phase, gas delivery system: two independent mass flow controllers (mfcs):a. one mfc (0-100 sccm) for argon gas feeding to all three sputtering sources via high vacuum valves.b. one mfc (0-100 sccm) for nitrogen gas feeding directly into the chamber with its own high vacuum valve.gas lines for ar and n2 are physically separated to avoid cross-contamination., chamber access and viewports: 1. two view ports installed on the chamber, each equipped with manual shutters. 2. access ports for gauges, pump, gas inlet and few spares for future upgradation., baking capability: entire chamber designed to bake-out at 150 c to reduce contamination and out gassing during operation, cooling capability : water manifold with flow switch / flow meters, near uhv chamber specification: chamber overview: spherical (diameter 14 ) or equivalent square shaped uhv chamber with stand., three 2-inch magnetron sputtering sources, each with individual gas inlet. all cf flanges and uhv viewports/ss blanks., substrate holder: a. diameter: 2inches; heating : molybdenum heater capable of heating substrate (a) from room temperature (rt) to 800 c during rotation and (b) from room temperature (rt) to 1000 c without rotation b. rotation : substrate holder driven by stepper motor. variable speed from 0 to10 rpmmovement: up / down vertical movement of total 25mm to adjust substrate position during deposition sputtering geometry: one sputtering source mounted parallel to substrate surface (tilt able preferred). two sputtering sources mounted confocally at an angle. base pressure : lower than 5 10 mbar (near uhv)., vacuum pumping system: turbo molecular pump : pfeiffer hipace 700 / edwards next 730 / leybold turbo vac 900 ix or equivalent with cf100 flange and integrated controller, suitable for near uhv vacuum., backing pump: pfeiffer hi scroll 12/edwards nxds15i / leybold scroll vac 15 plus or equivalent dry scroll pump used to back tmp, gate valves: one cf150 manual gate valve to isolate / throttle chamber from pumping system, vacuum gauges and measurement: cold cathode readout capable of dis