Tender For corrigendum : supply of digital weighing balance , laboratory oven , standard sieve set for coarse aggregate , standard set of sieve for fine aggregate , measuring cylinders , ring and ball apparatus , flakiness index test gauge , elongation index test gauge , vicat apparatus, with dashpot , compaction factor test apparatus , bulkdensityapparatus , m s concrete mixing tray , los angles abrasion test , core cutter , sand replacement test apparatus , standard proctor test apparatus , falling head permeability test apparatus , unconfined compression test apparatus , direct shear test apparatus , vane shear test apparatus , hand operated auger boring test apparatus and sampling , universal testing machine utm , consolidation apparatus , bitumen penetrometer , aggregate crushing value apparatus , aggregate impact test apparatus , ductility test of bitumen apparatus , optical square , cross staff , ranging rods , offset rods , prismatic compass with tripod stand , surveyor compass with tripod stand , dumpy level , plane table survey equipments , tilting level. , tangent clinometer , abney level , wooden pegs , wooden mallets , automatic level , dissolved oxygen meter , total dissolved solids meter , residual chlorine meter , conductivity meter , digital p h meter , building construction models , water supply waste water engineering models , transit vernier theodolite , concrete cube mould , cement concrete mould , curing tank , le chatllier apparatus , dgps ) /bid number: gem/2026/b/7165453 * /dated: 30-01-2026 & & / bid document1 / 40
Tender For procurement of wirebonder accessories - procurement of wirebonder accessories (as per technical specification), procurement of wirebonder accessories (as per technical specification)1) fine wire bond head (quantity: 01 no.) 4 axis bond operation (x,y,z,p) for bonding in any direction quick exchange of bond head (15 min) 17 to 75 m wire diameter bond force programmable from 10 to 250 cn standard wire feed, 45 wire feed angle (optional: 60 ) designed for 2 wire spool standard bondtool length is 1 selectable transducer (60 khz,100 khz, 120 khz and 145 khz) 2) standard stereo microscope (quantity: 01 no.) stereo zoom adjustable light intensity 3) bond process control system (quantity: 01 no.) for individual on-line monitoring of wire deformation, transducer voltage, transducer current, transducer frequency automatic adjustment of ultrasonic energy for consistent bond quality programmed target deformation programmed process window automatic process supervision immediate reaction on bond errors graphic recording and display of each bond quick set-up of new products through optical feedback simplified and improved quality control individual process documentation per bond can be upgraded with optional parts tracking